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SJTU and MIT Progressed in Research on Low Temperature Bonding of Electronic Devices

April 25, 2018      Author: Hang Tao

Recently on the authoritative nanomaterial magazine ACS Nano (Impact Factor 13.9), a new cooperative research result was published by Li Ming and Hu Anmin's team from the Institute of Microelectronic Materials and Technology of School of Materials Science and Engineering in Shanghai Jiao Tong University, and Kong Jing's team from the Department of Electrical Engineering and Computer Science in Massachusetts Institute of Technology. The paper reported a new low temperature bonding technology based on the composite of copper nanocones and single-layer graphene, which can effectively improve the reliability of bonding of electronic devices while lowering the bonding temperature.

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Associate professor Hu Anmin from SJTU School of Materials Science and Engineering and Professor Kong Jing from MIT are corresponding authors of this paper.  MIT PhD candidate Wang Haozhe (2015 Master and 2012 Bachelor of SJTU), MIT postdoctoral scholar Wei Sun Leong, SJTU IMMT PhD candidate Hu Fengtian, and SJTU master  candidate Ju Longlong are the first authors of this paper. 

 

Translated by Zhang Qianqian   Reviewed by Wang Bingyu